Optical Emission Spectroscopy (OES) and Plasma Emission Monitoring (PEM) technologies provide sophisticated, real-time, non-intrusive solutions for plasma process characterization, diagnostics, and control. OES operates in the UV-VIS-nIR range (200 to 1040 nm), offering high precision and sensitivity to detect even minor changes in plasma processes. This technology is crucial for advanced plasma process characterization and diagnostics, monitoring deviations and drift, and creating digital twins of plasma processes, which aids operations and maintenance and enhances overall process stability. On the other hand, PEM is designed for high-speed precision control of reactive gas flow and high-rate sputter deposition of compound films. It utilizes UV-VIS-nIR-based PEM technology (2B-PEM®) to ensure rapid and accurate mass production of thin films, making it ideal for composition control, co-sputtering metal-metal composites or fabrication of mixed compounds. PEM applications include high-rate optical film deposition, process quality control, metallurgical research, and process development. OES and PEM seamlessly integrate with production lines, providing continuous streams of high-quality data for AI-driven platforms, improving process monitoring and control capabilities, increasing product value and tool yield, and reducing overall ownership costs. Importantly, OES and PEM are key to robust implementations of autonomous thin-film materials discovery solutions, enabling precise and efficient exploration and development of new materials.